Connect Tech ThermiQ Passive Heatsink for NVIDIA Jetson AGX Orin

Connect Tech ThermiQ Passive Heatsink for NVIDIA Jetson AGX Orin Series. The heat sink at 60°C ambient needs an airflow of between 3 m/s and 4 m/s passing across it in order to maintain the module temperature around 80°C. Module temperature with airflow at 3 m/s (143 CFM) = 82.4°C. Module temperature with airflow at 4 m/s (190 CFM) = 78.5°C. 6063-T5 Aluminum Alloy with Black Anodize Type II finish. 100mm x 87mm x 33.15. MPN: XHG320