WDL Systems Product of the Day


Introducing the Innodisk EXMP-Q911, a COM-HPC Mini computer-on-module powered by the Qualcomm Dragonwing™ IQ-9075 SoC.

It's built for AI at the edge: 8 cores, 36GB LPDDR5X, 128GB UFS 3.1, and up to 100 dense TOPS of AI performance at low power, all in a credit-card-sized 95 x 70 mm module.

High-speed I/O includes PCIe Gen 4, dual 2.5GbE, dual 4-lane MIPI CSI-2 camera inputs, and DisplayPort. It's rated for -40°C to 85°C, includes TPM 2.0, and the chipset is supported through 2038.

Because COM-HPC Mini is an open standard, you can design your own carrier board around it. Yocto Linux and Ubuntu are supported, Innodisk offers BSPs and customization services, and the Qualcomm AI Hub provides 100+ validated models so you can start on-device inference right away.

A good fit for AMR and AGV robotics, multi-camera machine vision, factory automation, and smart city applications.

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